METHOD FOR MANUFACTURING THIN FILM HIGH FREQUENCY INDUCTOR

PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin film high frequency inductor from a substrate bored by a machine or laser. SOLUTION: After a via hole bored in a fixed position in a substrate 300 is filled with a metal to form a plug 302, by forming inductor coils 306b and electrode pins 306a on both sides of the substrate 300, the inductor coils 306b on both sides of the substrate 300 are electrically connected via the plug 302, then coating and protective layers 308 are formed on both sides of the element, the substrate is divided into sticks, and then by forming adhesive layers 310a and metal layers 310b around the sides of the divided substrate 300 using the physical gas phase sedimentation method, electrode connection conductive materials are formed, the electrode pins 306a on both sides of the substrate 300 are connected by them, respectively, and finally after they are divided into chips, electroplated buffer layers 311 and tin or tin lead layers are formed, the thickness of the electrode connection conductive materials on both sides is increased, and the manufacturing of the device is completed.