RESIN COMPOSITION AND MOLDED PRODUCT

PROBLEM TO BE SOLVED: To provide a resin composition improved in mechanical strength, heat resistance, and a coefficient of linear expansion, by adding an inorganic filler to a thermoplastic resin, and simultaneously capable of being inhibited in deterioration of flexibility, such as deflecting and...

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Bibliographische Detailangaben
Hauptverfasser:	KAMIFUKU ATSUSHI, ISHII YOSHIAKI, OTSUKA KENJIRO, YASUKI MINORU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition improved in mechanical strength, heat resistance, and a coefficient of linear expansion, by adding an inorganic filler to a thermoplastic resin, and simultaneously capable of being inhibited in deterioration of flexibility, such as deflecting and elongating characteristics, and to provide a molded product therefrom. SOLUTION: This resin composition is given by adding the scaly inorganic filler to the thermoplastic resin, wherein the resin has a melting point of >=300 deg.C, and the scaly inorganic filler has a heat of wetting of