BGA MULTILAYER SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a BGA multilayer semiconductor module with an improved reliability. SOLUTION: The BGA multilayer semiconductor module has such a structure that circuit boards, each mounted with a semiconductor chip, are so disposed that they overlap each other at a plurality of places at regular intervals, and each of the circuit board is formed with a plurality of connection terminals at the top and the rear face, with the connection terminals on the top and rear faces in electrical continuity with each other if necessary, and the connection terminals on the rear face of one circuit board and those on the top face of another circuit board in the next stage are electrically connected by solder bumps. In the BGA multilayer semiconductor module of this structure, the area of some of the connection terminals is made large, resulting in the increase in reliability.