APPARATUS AND METHOD FOR PLATING

PROBLEM TO BE SOLVED: To provide a plating technology which can easily replace an article to be plated, along with enabling uniform plating because of not receiving an effect of bubbles in a plating liquid, by improving a wet plating apparatus of a contact type, and solving problems of removal of th...

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Bibliographische Detailangaben
1. Verfasser:	SAKAKI YASUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a plating technology which can easily replace an article to be plated, along with enabling uniform plating because of not receiving an effect of bubbles in a plating liquid, by improving a wet plating apparatus of a contact type, and solving problems of removal of the bubbles in the plating liquid, removal of an adhering plating liquid and the like. SOLUTION: The plating apparatus having a plating tank, is provided with an opening 5 having a liquid seal 4 for preventing the plating liquid from leaking when mounting the article to be plated 3, a liquid feeding part for supplying the plating liquid, a liquid discharging part for discharging the plating liquid, and an anode 10 which faces to the mounted article to be plated, wherein the plating tank has a rotation means 8 for rotating the plating tank itself.