METHOD OF CUTTING NONMETALLIC SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method of cutting a nonmetallic substrate. SOLUTION: An expected cutting line 1a showing the portion to be cut of the nonmetallic substrate is subjected to quick heating and quick cooling, and the substrate is cut by a thermal stress thereby generated. The shape, d...

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Bibliographische Detailangaben
Hauptverfasser:	KIM HYAKUKIN, SHU DAIKO, NAM HYUNG-WOO, KWON YONG-JOON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of cutting a nonmetallic substrate. SOLUTION: An expected cutting line 1a showing the portion to be cut of the nonmetallic substrate is subjected to quick heating and quick cooling, and the substrate is cut by a thermal stress thereby generated. The shape, disposition, etc., of an energy source for quickly heating the expected cutting line 1a are optimized so that a speed of cutting of the substrate can be maximized and that, at the same time, the nonmetallic substrate can be cut precisely as expected.