APPARATUS AND METHOD FOR JOINING MATERIAL LAYER

PROBLEM TO BE SOLVED: To provide a method and an apparatus for joining multiple layers using an ultrasonic welding apparatus. SOLUTION: This welding apparatus utilizes a sonotrode 14 to perform a weld between at least a top layer 26 and an intermediate layer 28 of a multi- layer member 24. Either th...

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Bibliographische Detailangaben
Hauptverfasser: SKOGSMO JAN B, WEXLER ARNON, POPOOLA OLUDELE OLUSEGUN, COOPER RONALD P, KOEHL ROBERT, VAN REATHERFORD LARRY, WILKOSZ DANIEL E
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method and an apparatus for joining multiple layers using an ultrasonic welding apparatus. SOLUTION: This welding apparatus utilizes a sonotrode 14 to perform a weld between at least a top layer 26 and an intermediate layer 28 of a multi- layer member 24. Either the multi-layered member 24 or the ultrasonic welding apparatus is rotated such that a bottom layer 30 is positioned adjacent to the sonotrode 14 so that the sonotrode 14 can form a weld between at least the bottom layer 30 and the intermediate layer 28 of the multi-layer member 24. This apparatus includes an ultrasonic welding gun having a C-shape frame including a base portion and a head portion is secured to the head portion, and an anvil 20 is secured to the base portion. The ultrasonic welding gun is connected to a robot operative to position and rotate the ultrasonic welding gun to perform the welding operation.