ELECTRIC COMPONENT AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide an electric component and a manufacturing method of the electric component for which an entire package product is compact and manufacturing properties are superior. SOLUTION: Between a semiconductor device 6 and a wiring board 4, resin layers 11 and 11a that an be ea...

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Bibliographische Detailangaben
1. Verfasser:	KIMIJIMA SUSUMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electric component and a manufacturing method of the electric component for which an entire package product is compact and manufacturing properties are superior. SOLUTION: Between a semiconductor device 6 and a wiring board 4, resin layers 11 and 11a that an be easily deformed even after cured toward the outsides of bumps 5a and 5b to 5n are charged over the entire circumference of the semiconductor device 6, and a hollow section 12 is formed inside the bump 5a, and 5b to 5n.