PRINTED WIRING BOARD AND SEMICONDUCTOR MANUFACTURING METHOD USING THE SAME

PROBLEM TO BE SOLVED: To provide a printed wiring board for achieving non-continuity between required wiring patterns by simply and reliably cutting a common wiring pattern in a printed circuit board where a high-density continuity pattern section is wired, and to provide a manufacturing method of a semiconductor using the printed wiring board. SOLUTION: A printed wiring board 1 has a continuity pattern section 5 that comprises required wiring patterns 3 and 3a for connecting a semiconductor chip 9 to be packaged for constituting a circuit, and a common wiring pattern 4 for connecting each of the required wiring pattern 3 and 3a so that each can be subjected to electrolytic plating. The printed wiring board 1 is cut by an edged tool together with the continuity section 5 and is formed into individual substrates 7 and 7a where each of the required wiring patterns 3 and 3a does not conduct electricity. In the printed wiring board 1, the width in at least the partial common wiring pattern 4 is smaller than the cut width of the edged tool, and at the same time, the longitudinal direction of the common wiring pattern 4 is made to coincide with the cutting direction.