PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To solve a problem that a semiconductor package slightly moves when soldering and a positioning defect occurs when the semiconductor package of multiple pins is mounted on a printed wiring board. SOLUTION: Since the semiconductor package of narrow pitches and multiple pins is p...

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Bibliographische Detailangaben
Hauptverfasser:	ITO KAZUNORI, MIZUI SHIGENOBU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve a problem that a semiconductor package slightly moves when soldering and a positioning defect occurs when the semiconductor package of multiple pins is mounted on a printed wiring board. SOLUTION: Since the semiconductor package of narrow pitches and multiple pins is precisely mounted on the printed wiring board, the shapes of connection foot prints 1 at an outermost peripheral part disposed in the printed wiring board are made to be larger than the areas of the other connection lands 2 on an inner side. Thus, dislocation is eliminated by self-alignment.