MOUNTING STRUCTURE AND MOUNTING STRUCTURE FOR CARD- SHAPED ELECTRONIC EQUIPMENT

PROBLEM TO BE SOLVED: To provide a three-dimensional mounting structure for components and a mounting structure for card-shaped electronic equipment each with a low cost, by interposing electronic components between substrates for mutual electrical connection as well as for ensuring a distance between the substrates to accommodate electronic components between the substrates. SOLUTION: This mounting structure is a laminate of a plurality of wiring substrates which are spaced with a gap and mutually electrically connected. At least one wiring substrate selected from an upper-layer wiring substrate 10 and a lower-layer wiring substrate 20 of the wiring substrates is provided with electronic components 50 mounted on regions of the same substrate surface on which electrically conductive terminals 11 or 21 for electrically connecting the both wiring substrates are formed, except the regions where the electrically conductive terminals are located; electrically conductive components 30 for electrically connecting mutually-facing electrically conductive terminals on the upper-layer and lower-layer wiring substrates; and electrically connecting material members 40 for connecting the electrically conductive terminals 11 or 21 and the electrically conductive components 30.