SHIELDED SOCKET

PROBLEM TO BE SOLVED: To provide a low-cost IC socket easy to assemble and with an EMI shield. SOLUTION: The shielded socket 10 for mounting an IC package 20 on a circuit board 34 is provided with a frame 12 having 4 sides made of an insulating material. The sides of the frame 12 surround a center c...

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Hauptverfasser: GOODWIN JONATHAN W, KNAUB CURTIS G, YUE CHUANLONG
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creator GOODWIN JONATHAN W
KNAUB CURTIS G
YUE CHUANLONG
description PROBLEM TO BE SOLVED: To provide a low-cost IC socket easy to assemble and with an EMI shield. SOLUTION: The shielded socket 10 for mounting an IC package 20 on a circuit board 34 is provided with a frame 12 having 4 sides made of an insulating material. The sides of the frame 12 surround a center cavity 18 with dimension accepting the IC package 20. A contact assembly 14 equipped with a contact element array is mounted under the frame 12 in order to connect the IC package with the circuit board 34. A conductive member 24 is arranged inside a narrow opening 22 within each side of the frame 12. Since the conductive member 24 is extended to the underside of the frame 12 to get engaged with each ground area 40 of the circuit board 34, an EMI shield is provided for the IC package mounted inside the frame 12.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2003109717A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2003109717A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2003109717A3</originalsourceid><addsrcrecordid>eNrjZOAP9vB09XFxdVEI9nf2dg3hYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgbGhgaW5obmjsZEKQIAFosdkQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SHIELDED SOCKET</title><source>esp@cenet</source><creator>GOODWIN JONATHAN W ; KNAUB CURTIS G ; YUE CHUANLONG</creator><creatorcontrib>GOODWIN JONATHAN W ; KNAUB CURTIS G ; YUE CHUANLONG</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a low-cost IC socket easy to assemble and with an EMI shield. SOLUTION: The shielded socket 10 for mounting an IC package 20 on a circuit board 34 is provided with a frame 12 having 4 sides made of an insulating material. The sides of the frame 12 surround a center cavity 18 with dimension accepting the IC package 20. A contact assembly 14 equipped with a contact element array is mounted under the frame 12 in order to connect the IC package with the circuit board 34. A conductive member 24 is arranged inside a narrow opening 22 within each side of the frame 12. Since the conductive member 24 is extended to the underside of the frame 12 to get engaged with each ground area 40 of the circuit board 34, an EMI shield is provided for the IC package mounted inside the frame 12.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20030411&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003109717A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20030411&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003109717A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GOODWIN JONATHAN W</creatorcontrib><creatorcontrib>KNAUB CURTIS G</creatorcontrib><creatorcontrib>YUE CHUANLONG</creatorcontrib><title>SHIELDED SOCKET</title><description>PROBLEM TO BE SOLVED: To provide a low-cost IC socket easy to assemble and with an EMI shield. SOLUTION: The shielded socket 10 for mounting an IC package 20 on a circuit board 34 is provided with a frame 12 having 4 sides made of an insulating material. The sides of the frame 12 surround a center cavity 18 with dimension accepting the IC package 20. A contact assembly 14 equipped with a contact element array is mounted under the frame 12 in order to connect the IC package with the circuit board 34. A conductive member 24 is arranged inside a narrow opening 22 within each side of the frame 12. Since the conductive member 24 is extended to the underside of the frame 12 to get engaged with each ground area 40 of the circuit board 34, an EMI shield is provided for the IC package mounted inside the frame 12.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAP9vB09XFxdVEI9nf2dg3hYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgbGhgaW5obmjsZEKQIAFosdkQ</recordid><startdate>20030411</startdate><enddate>20030411</enddate><creator>GOODWIN JONATHAN W</creator><creator>KNAUB CURTIS G</creator><creator>YUE CHUANLONG</creator><scope>EVB</scope></search><sort><creationdate>20030411</creationdate><title>SHIELDED SOCKET</title><author>GOODWIN JONATHAN W ; KNAUB CURTIS G ; YUE CHUANLONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003109717A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>GOODWIN JONATHAN W</creatorcontrib><creatorcontrib>KNAUB CURTIS G</creatorcontrib><creatorcontrib>YUE CHUANLONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GOODWIN JONATHAN W</au><au>KNAUB CURTIS G</au><au>YUE CHUANLONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SHIELDED SOCKET</title><date>2003-04-11</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To provide a low-cost IC socket easy to assemble and with an EMI shield. SOLUTION: The shielded socket 10 for mounting an IC package 20 on a circuit board 34 is provided with a frame 12 having 4 sides made of an insulating material. The sides of the frame 12 surround a center cavity 18 with dimension accepting the IC package 20. A contact assembly 14 equipped with a contact element array is mounted under the frame 12 in order to connect the IC package with the circuit board 34. A conductive member 24 is arranged inside a narrow opening 22 within each side of the frame 12. Since the conductive member 24 is extended to the underside of the frame 12 to get engaged with each ground area 40 of the circuit board 34, an EMI shield is provided for the IC package mounted inside the frame 12.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CURRENT COLLECTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title SHIELDED SOCKET
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