SHIELDED SOCKET

PROBLEM TO BE SOLVED: To provide a low-cost IC socket easy to assemble and with an EMI shield. SOLUTION: The shielded socket 10 for mounting an IC package 20 on a circuit board 34 is provided with a frame 12 having 4 sides made of an insulating material. The sides of the frame 12 surround a center c...

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Bibliographische Detailangaben
Hauptverfasser:	GOODWIN JONATHAN W, KNAUB CURTIS G, YUE CHUANLONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a low-cost IC socket easy to assemble and with an EMI shield. SOLUTION: The shielded socket 10 for mounting an IC package 20 on a circuit board 34 is provided with a frame 12 having 4 sides made of an insulating material. The sides of the frame 12 surround a center cavity 18 with dimension accepting the IC package 20. A contact assembly 14 equipped with a contact element array is mounted under the frame 12 in order to connect the IC package with the circuit board 34. A conductive member 24 is arranged inside a narrow opening 22 within each side of the frame 12. Since the conductive member 24 is extended to the underside of the frame 12 to get engaged with each ground area 40 of the circuit board 34, an EMI shield is provided for the IC package mounted inside the frame 12.