BULB DEVICE FOR SUBSTRATE MOUNT
PROBLEM TO BE SOLVED: To improve connection by connecting by solder 11 the lead wire 10 wound on the lead wire winding part 6 provided on the diagonal of the small bulb socket 1 and the land 16. SOLUTION: A pair of locking protrusions 4, 4 are provided on the outer circumference of the bottomed cyli...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To improve connection by connecting by solder 11 the lead wire 10 wound on the lead wire winding part 6 provided on the diagonal of the small bulb socket 1 and the land 16. SOLUTION: A pair of locking protrusions 4, 4 are provided on the outer circumference of the bottomed cylindrical holder 3, and a pair of flange parts 5, 5 are provided on the lower outer circumference. Lead wire winding parts 6, 6 of square pole shape are provided on the diagonal of the flange parts 5, 5 in right angle to the line connecting the lead wire lead-out holes 7, 7. The lead wires 10, 10 of the base-less bulb 9 are wound on the lead wire winding parts 6, 6 passing the lead wire lead-out holes 7, 7 and through the lead wire guide grooves 8, 8. The lead wires 10, 10 on the lead wire winding parts 6, 6 and the land of the printed-circuit board are connected by solder. |
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