METHOD OF WIRE BONDING

METHOD OF WIRE BONDING

PROBLEM TO BE SOLVED: To provide a wire bonding method capable of suppressing generation of curl of a wire and fully securing bonding performance to a bonding surface. SOLUTION: In the wire bonding method, a metal wire inserted through the center of a capillary is bonded to a bonding part formed on...

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1. Verfasser: YOSHINO HIDENORI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description PROBLEM TO BE SOLVED: To provide a wire bonding method capable of suppressing generation of curl of a wire and fully securing bonding performance to a bonding surface. SOLUTION: In the wire bonding method, a metal wire inserted through the center of a capillary is bonded to a bonding part formed on a substrate or a semiconductor element, by utilizing a bonding load and supersonic vibration. There are provided in the method: the first process to conduct a bonding operation while a predetermined load (P1) is applied; the second process to move the capillary horizontally for a predetermined distance A, once the bonding load is decreased (P2); and the third process to increase (P3) again the bonding load at the position where the capillary is moved and conduct the bonding operation.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2003100793A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2003100793A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2003100793A3</originalsourceid><addsrcrecordid>eNrjZBDzdQ3x8HdR8HdTCPcMclVw8vdz8fRz52FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGxoYGBuaWxo7GRCkCANqtH1E</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF WIRE BONDING</title><source>esp@cenet</source><creator>YOSHINO HIDENORI</creator><creatorcontrib>YOSHINO HIDENORI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a wire bonding method capable of suppressing generation of curl of a wire and fully securing bonding performance to a bonding surface. SOLUTION: In the wire bonding method, a metal wire inserted through the center of a capillary is bonded to a bonding part formed on a substrate or a semiconductor element, by utilizing a bonding load and supersonic vibration. There are provided in the method: the first process to conduct a bonding operation while a predetermined load (P1) is applied; the second process to move the capillary horizontally for a predetermined distance A, once the bonding load is decreased (P2); and the third process to increase (P3) again the bonding load at the position where the capillary is moved and conduct the bonding operation.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20030404&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003100793A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20030404&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003100793A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHINO HIDENORI</creatorcontrib><title>METHOD OF WIRE BONDING</title><description>PROBLEM TO BE SOLVED: To provide a wire bonding method capable of suppressing generation of curl of a wire and fully securing bonding performance to a bonding surface. SOLUTION: In the wire bonding method, a metal wire inserted through the center of a capillary is bonded to a bonding part formed on a substrate or a semiconductor element, by utilizing a bonding load and supersonic vibration. There are provided in the method: the first process to conduct a bonding operation while a predetermined load (P1) is applied; the second process to move the capillary horizontally for a predetermined distance A, once the bonding load is decreased (P2); and the third process to increase (P3) again the bonding load at the position where the capillary is moved and conduct the bonding operation.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDzdQ3x8HdR8HdTCPcMclVw8vdz8fRz52FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGxoYGBuaWxo7GRCkCANqtH1E</recordid><startdate>20030404</startdate><enddate>20030404</enddate><creator>YOSHINO HIDENORI</creator><scope>EVB</scope></search><sort><creationdate>20030404</creationdate><title>METHOD OF WIRE BONDING</title><author>YOSHINO HIDENORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003100793A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHINO HIDENORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHINO HIDENORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF WIRE BONDING</title><date>2003-04-04</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To provide a wire bonding method capable of suppressing generation of curl of a wire and fully securing bonding performance to a bonding surface. SOLUTION: In the wire bonding method, a metal wire inserted through the center of a capillary is bonded to a bonding part formed on a substrate or a semiconductor element, by utilizing a bonding load and supersonic vibration. There are provided in the method: the first process to conduct a bonding operation while a predetermined load (P1) is applied; the second process to move the capillary horizontally for a predetermined distance A, once the bonding load is decreased (P2); and the third process to increase (P3) again the bonding load at the position where the capillary is moved and conduct the bonding operation.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD OF WIRE BONDING
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T03%3A24%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YOSHINO%20HIDENORI&rft.date=2003-04-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2003100793A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true