METHOD OF WIRE BONDING

PROBLEM TO BE SOLVED: To provide a wire bonding method capable of suppressing generation of curl of a wire and fully securing bonding performance to a bonding surface. SOLUTION: In the wire bonding method, a metal wire inserted through the center of a capillary is bonded to a bonding part formed on a substrate or a semiconductor element, by utilizing a bonding load and supersonic vibration. There are provided in the method: the first process to conduct a bonding operation while a predetermined load (P1) is applied; the second process to move the capillary horizontally for a predetermined distance A, once the bonding load is decreased (P2); and the third process to increase (P3) again the bonding load at the position where the capillary is moved and conduct the bonding operation.