SINGLE-FACE POLISHING DEVICE

PROBLEM TO BE SOLVED: To prevent a position error of a chuck mechanism in a single-face polishing device and to suppress erroneous absorption, lowering of the precision, or erroneous chuck by the prevention of the position error. SOLUTION: An index head 2 and a frame 12 are provided with paired lock...

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Bibliographische Detailangaben
1. Verfasser:	NISHIKAWA SHINZO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent a position error of a chuck mechanism in a single-face polishing device and to suppress erroneous absorption, lowering of the precision, or erroneous chuck by the prevention of the position error. SOLUTION: An index head 2 and a frame 12 are provided with paired lock devices 4. A lock pin 43 is advanced by an air cylinder to be fitted in a pin hole in a pin receiver body 42 so that the index head 2 substantially becomes a center impeller type and improves the rigidity. This constitution can prevent or suppress the propagation of the vibration and the displacement of the chuck shaft 21.