INSULATION FILM FORMING MATERIAL

PROBLEM TO BE SOLVED: To provide an insulation film forming material which has superior insulation property, solvent resistance, heat resistance and proper adherence with a substrate, and can be formed into a desired pattern. SOLUTION: The insulation film forming material made of a polymer, thermose...

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Bibliographische Detailangaben
Hauptverfasser:	KOSUGE YUJI, NAKASONE SHINYA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an insulation film forming material which has superior insulation property, solvent resistance, heat resistance and proper adherence with a substrate, and can be formed into a desired pattern. SOLUTION: The insulation film forming material made of a polymer, thermosetting agent, and a solvent is characterized by that the polymer is made of alkali-soluble resin in a structure shown by a formula (I). In the formula, R1 is H or CH3 , A OA1 or NA2 A3 (A1 , A2 , A3 : H, C1 -C6 alkyl, C6 -C12 aryl, C7 -C12 aralykyl), and k and m are integers larger than 1, and n an integer equal to or larger than 1.