SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To realize a large-output high-frequency circuit which is superior in impedance matching and small in a resistance loss in a semiconductor device, equipped with a SAW device on a semiconductor chip. SOLUTION: A passive element chip 2 is formed with a passive element circuit 4,...

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Bibliographische Detailangaben
1. Verfasser:	KAWAI TAKAHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To realize a large-output high-frequency circuit which is superior in impedance matching and small in a resistance loss in a semiconductor device, equipped with a SAW device on a semiconductor chip. SOLUTION: A passive element chip 2 is formed with a passive element circuit 4, which includes a transmission line 4c on an upper surface of a semi- insulating compound semiconductor substrate 2a having a lower surface thereof as a grounding potential 2b. A SAW device chip 3 is equipped on the passive element chip 2. Even if the width of the transmission line 4c is increased, high characteristic impedance can be maintained, by increasing a thickness of the substrate 2a. As the result, the resistance of the transmission line can be reduced and the SAW device can be matched easily.