METHOD FOR MANUFACTURING TAPE CARRIER FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a tape carrier for a semiconductor device capable of holding a cross section of a wiring lead which is close to a rectangular section even under conditions that, as a wiring pitch of a circuit, L is 25 μm or less and S is 25 μm or less. SOL...

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Bibliographische Detailangaben
1. Verfasser: MORISHITA SHIGEHIRO
Format: Patent
Sprache:eng
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