METHOD FOR MANUFACTURING TAPE CARRIER FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a tape carrier for a semiconductor device capable of holding a cross section of a wiring lead which is close to a rectangular section even under conditions that, as a wiring pitch of a circuit, L is 25 μm or less and S is 25 μm or less. SOL...

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Bibliographische Detailangaben
1. Verfasser:	MORISHITA SHIGEHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY NOZZLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a tape carrier for a semiconductor device capable of holding a cross section of a wiring lead which is close to a rectangular section even under conditions that, as a wiring pitch of a circuit, L is 25 μm or less and S is 25 μm or less. SOLUTION: In a method for manufacturing a tape carrier for a semiconductor device, etching agent 1 is injected by a spray on a copper foil 3 provided on one plane or both planes of an insulating tape base material 5 by a subtract method, and an unwanted location of the copper foil 3 is removed by etching to form a circuit wiring pattern. The etching agent 1 after the spray injection in the etching process is accelerated by using assist air.