METHOD FOR MANUFACTURING TAPE CARRIER FOR SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING TAPE CARRIER FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a tape carrier for a semiconductor device capable of holding a cross section of a wiring lead which is close to a rectangular section even under conditions that, as a wiring pitch of a circuit, L is 25 μm or less and S is 25 μm or less. SOL...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: MORISHITA SHIGEHIRO
Format: Patent
Sprache:eng
Schlagworte:
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
ATOMISING APPARATUS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
NOZZLES
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SPRAYING APPARATUS
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator MORISHITA SHIGEHIRO
description PROBLEM TO BE SOLVED: To provide a method for manufacturing a tape carrier for a semiconductor device capable of holding a cross section of a wiring lead which is close to a rectangular section even under conditions that, as a wiring pitch of a circuit, L is 25 μm or less and S is 25 μm or less. SOLUTION: In a method for manufacturing a tape carrier for a semiconductor device, etching agent 1 is injected by a spray on a copper foil 3 provided on one plane or both planes of an insulating tape base material 5 by a subtract method, and an unwanted location of the copper foil 3 is removed by etching to form a circuit wiring pattern. The etching agent 1 after the spray injection in the etching process is accelerated by using assist air.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2003086639A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2003086639A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2003086639A3</originalsourceid><addsrcrecordid>eNrjZLDzdQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXCHEMcFVwdgwK8nQNAksHu_p6Ovv7uYQ6hwB5Lq5hns6uPAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3ivAyMDA2MDCzMzY0tGYKEUAsp4qpw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR MANUFACTURING TAPE CARRIER FOR SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>MORISHITA SHIGEHIRO</creator><creatorcontrib>MORISHITA SHIGEHIRO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a method for manufacturing a tape carrier for a semiconductor device capable of holding a cross section of a wiring lead which is close to a rectangular section even under conditions that, as a wiring pitch of a circuit, L is 25 μm or less and S is 25 μm or less. SOLUTION: In a method for manufacturing a tape carrier for a semiconductor device, etching agent 1 is injected by a spray on a copper foil 3 provided on one plane or both planes of an insulating tape base material 5 by a subtract method, and an unwanted location of the copper foil 3 is removed by etching to form a circuit wiring pattern. The etching agent 1 after the spray injection in the etching process is accelerated by using assist air.</description><edition>7</edition><language>eng</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; ATOMISING APPARATUS ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; NOZZLES ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SPRAYING APPARATUS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20030320&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003086639A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20030320&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003086639A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORISHITA SHIGEHIRO</creatorcontrib><title>METHOD FOR MANUFACTURING TAPE CARRIER FOR SEMICONDUCTOR DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a method for manufacturing a tape carrier for a semiconductor device capable of holding a cross section of a wiring lead which is close to a rectangular section even under conditions that, as a wiring pitch of a circuit, L is 25 μm or less and S is 25 μm or less. SOLUTION: In a method for manufacturing a tape carrier for a semiconductor device, etching agent 1 is injected by a spray on a copper foil 3 provided on one plane or both planes of an insulating tape base material 5 by a subtract method, and an unwanted location of the copper foil 3 is removed by etching to form a circuit wiring pattern. The etching agent 1 after the spray injection in the etching process is accelerated by using assist air.</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>ATOMISING APPARATUS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>NOZZLES</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING APPARATUS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDzdQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXCHEMcFVwdgwK8nQNAksHu_p6Ovv7uYQ6hwB5Lq5hns6uPAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3ivAyMDA2MDCzMzY0tGYKEUAsp4qpw</recordid><startdate>20030320</startdate><enddate>20030320</enddate><creator>MORISHITA SHIGEHIRO</creator><scope>EVB</scope></search><sort><creationdate>20030320</creationdate><title>METHOD FOR MANUFACTURING TAPE CARRIER FOR SEMICONDUCTOR DEVICE</title><author>MORISHITA SHIGEHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003086639A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>ATOMISING APPARATUS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>NOZZLES</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING APPARATUS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MORISHITA SHIGEHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORISHITA SHIGEHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING TAPE CARRIER FOR SEMICONDUCTOR DEVICE</title><date>2003-03-20</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To provide a method for manufacturing a tape carrier for a semiconductor device capable of holding a cross section of a wiring lead which is close to a rectangular section even under conditions that, as a wiring pitch of a circuit, L is 25 μm or less and S is 25 μm or less. SOLUTION: In a method for manufacturing a tape carrier for a semiconductor device, etching agent 1 is injected by a spray on a copper foil 3 provided on one plane or both planes of an insulating tape base material 5 by a subtract method, and an unwanted location of the copper foil 3 is removed by etching to form a circuit wiring pattern. The etching agent 1 after the spray injection in the etching process is accelerated by using assist air.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2003086639A
source esp@cenet
subjects APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
ATOMISING APPARATUS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
NOZZLES
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SPRAYING APPARATUS
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
title METHOD FOR MANUFACTURING TAPE CARRIER FOR SEMICONDUCTOR DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T10%3A36%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MORISHITA%20SHIGEHIRO&rft.date=2003-03-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2003086639A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true