COATING FORMING AGENT FOR REDUCING PATTERN DIMENSION OF RESIST PATTERN AND FINE RESIST PATTERN FORMING METHOD USING THE SAME

PROBLEM TO BE SOLVED: To provide a coating forming agent for reducing the pattern dimension of a resist pattern, which is disposed on a resist pattern formed using a photoresist when the resist pattern is thermally shrunk to form a fine resist pattern, can smoothly cause thermal shrinkage of the res...

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Bibliographische Detailangaben
Hauptverfasser:	KANEKO FUMITAKE, TACHIKAWA TOSHIKAZU, SUGATA YOSHIKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a coating forming agent for reducing the pattern dimension of a resist pattern, which is disposed on a resist pattern formed using a photoresist when the resist pattern is thermally shrunk to form a fine resist pattern, can smoothly cause thermal shrinkage of the resist pattern by heat treatment and can easily be removed by washing with water after the heat treatment of the resist pattern and to provide a method for efficiently forming a fine resist pattern using the coating forming agent. SOLUTION: In the fine resist pattern forming method comprising a step for forming a resist pattern on a substrate, a step for disposing a water-soluble resin film on the whole area or part of the resist pattern, a step for heat- treating the substrate to reduce the pattern interval and a step for washing and removing the water-soluble resin film, a copolymer of (A) at least one monomer selected from acrylic acid and methacrylic acid and (B) at least one monomer selected from water-soluble vinyl compounds other than the component (A) is used as the water-soluble resin.