LASER MACHINING DEVICE

PROBLEM TO BE SOLVED: To provide an economical laser machining device in which a machining position which is irradiated with a laser beam is accurately moved at high speed with a simple and easy means. SOLUTION: The laser machining device is suitable for machining a lot of fine holes such as via hol...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMAMOTO EITETSU, GOTO KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an economical laser machining device in which a machining position which is irradiated with a laser beam is accurately moved at high speed with a simple and easy means. SOLUTION: The laser machining device is suitable for machining a lot of fine holes such as via holes on a high density multilayer wiring board. In the device, a laser oscillator 1 is provided with an X scanner means 5 furnished with a scanning mirror on a galvanometer so that the laser beam is swung in the X-direction on the surface of a work which is irradiated with the laser beam. Further, a work holder 10 which holds the work W in a way that the X-direction of the work coincides with the track of the focal distance of the X scanner means 5, is arranged. The laser oscillator 1 or the work holder 10 is mounted on a Y-stage 15 which is movable in the Y-direction in order to move the machining point in the Y-direction.