APPARATUS AND METHOD FOR COMPONENT MOUNTING

PROBLEM TO BE SOLVED: To provide a component mounting apparatus provided with a suction nozzle by which there is no fear that a component deviates or falls even when the component is moved at high speed, and to provide a component mounting method. SOLUTION: In the component mounting apparatus, the c...

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Bibliographische Detailangaben
Hauptverfasser:	IMAFUKU SHIGEKI, YOSHITAKE TAKANORI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a component mounting apparatus provided with a suction nozzle by which there is no fear that a component deviates or falls even when the component is moved at high speed, and to provide a component mounting method. SOLUTION: In the component mounting apparatus, the component is sucked to a suction-nozzle end, and the component is mounted by moving the suction nozzle to a component mounting position from a component feeding position. A shielding means is installed which shields an airflow hitting the component sucked by the suction nozzle when the suction nozzle is moved.