CHIP-STACKED PACKAGE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a chip-stacked package device composed of stacked semiconductor IC devices of the same size and its manufacturing method. SOLUTION: A chip-stacked package device 100 is equipped with a board 10 provided with a mounting surface 12 and an undersurface 13, a lower semic...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KYO SHIIN, OH SE YONG, KWON YONG-HWAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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