PATTERNING METHOD OF PHOTOSENSITIVE RESIN

PROBLEM TO BE SOLVED: To provide a manufacturing process which can simplify a process by forming a plurality of photosensitive resin film thickness and continuously working films to be worked, without using a photo mask for gray-tone exposure. SOLUTION: A plurality of the films to be worked are form...

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Bibliographische Detailangaben
1. Verfasser:	TAKEGAWA HIROZO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing process which can simplify a process by forming a plurality of photosensitive resin film thickness and continuously working films to be worked, without using a photo mask for gray-tone exposure. SOLUTION: A plurality of the films to be worked are formed on a substrate. When patterning is conducted, in such a manner that the pattern width of a lower layer is greater than that of an upper layer, positive-type photosensitive resin is spread, exposure is made via a first photo mask after drying, and then exposure is performed with an exposure value smaller than the first exposure, via a second photo mask.