IC MOUNTING BODY

PROBLEM TO BE SOLVED: To provide an IC mounting body elongating the serviceable life by preventing corrosion of an antenna constituting an IC module in the IC mounting body. SOLUTION: This IC mounting body is so formed that an IC chip 21 and an inlet holding the antenna 22 electrically connected to...

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Bibliographische Detailangaben
1. Verfasser:	FUJIKI YASUTAKE
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES ADVERTISING BOOK COVERS BOOKBINDING CALCULATING CHEMISTRY COMPUTING COUNTING CRYPTOGRAPHY DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR DISPLAY DISPLAYING DYES EDUCATION FILES HANDLING RECORD CARRIERS LABELS OR NAME-PLATES LOOSE LEAVES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MOVABLE-STRIP WRITING OR READING APPARATUS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS PHYSICS POLISHES PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEALS SIGNS SPECIAL PRINTED MATTER TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an IC mounting body elongating the serviceable life by preventing corrosion of an antenna constituting an IC module in the IC mounting body. SOLUTION: This IC mounting body is so formed that an IC chip 21 and an inlet holding the antenna 22 electrically connected to the IC chip 21 are stacked on a display substrate 11 via a pressure sensitive adhesive layer 12, the pressure sensitive adhesive layer 12 positioned in the opposite side of a surface side having the inlet and a release paper 13 protecting the pressure sensitive adhesive layer 12 are provided, and the ratio of carboxylic acid containing monomer in the pressure sensitive adhesive layer 12 is 2 mass% or less.