IC MOUNTING BODY

PROBLEM TO BE SOLVED: To provide an IC mounting body elongating the serviceable life by preventing corrosion of an antenna constituting an IC module in the IC mounting body. SOLUTION: This IC mounting body is so formed that an IC chip 21, an inlet holding the antenna 22 electrically connected theret...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: FUJIKI YASUTAKE
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an IC mounting body elongating the serviceable life by preventing corrosion of an antenna constituting an IC module in the IC mounting body. SOLUTION: This IC mounting body is so formed that an IC chip 21, an inlet holding the antenna 22 electrically connected thereto, and a display substrate 11 are stacked, a pressure sensitive adhesive layer 12 positioned in the opposite side of a surface side having the inlet and a release paper 13 protecting the pressure sensitive adhesive layer 12 are provided, and the content of anion of the display substrate 11 is 100 ppm or less. The display substrate 11 is neutralized paper or paper using a pulp bleached by bleach except for chlorine. This IC mounting body is provided with the pressure sensitive adhesive layer 12 and the release paper 13 protecting the pressure sensitive adhesive layer 12 on a surface having the IC chip 21 and the inlet holding the antenna 22 electrically connected thereto, and the content of the anion of the release paper 13 is 100 ppm or less. The release paper 13 is the neutralized paper or the paper using a pulp bleached by the bleach except for chlorine.