HIGH-FREQUENCY SEMICONDUCTOR MODULE AND PACKAGING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a packaging method for electrically, simply, and accurately connecting a conductor on substrate wiring having a high-frequency line to a semiconductor bare ship and/or a chip component such as capacitor, reducing the transmission loss of a signal at a connection section furthermore, and at the same time securing connection reliability in a semiconductor module for high frequencies used for an automobile radar, a radio LAN, and the like. SOLUTION: A conductor on substrate wiring having a high-frequency line is electrically connected to a semiconductor bare chip and/or a chip component such as a capacitor by a TAB tape with a one-side conductor layer.