METHOD OF POLISHING BOARD

PROBLEM TO BE SOLVED: To provide a method of polishing a metal laminated film, which polishes the film without thinning of an interlayer insulation film, after the surface of the metal laminated film is relieved of irregularities by filling the recessed parts of the metal laminated film with resin....

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Bibliographische Detailangaben
Hauptverfasser:	SHIMAMURA YASUO, TERASAKI HIROKI, KURATA YASUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of polishing a metal laminated film, which polishes the film without thinning of an interlayer insulation film, after the surface of the metal laminated film is relieved of irregularities by filling the recessed parts of the metal laminated film with resin. SOLUTION: When a metal laminated film, having irregularities on its surface, is polished by a method where a board, which is fixed to a holder and has a metal laminated film having irregularities on its surface, is pressed against an abrasive cloth and the board, the abrasive cloth are moved relative to each other to polish the metal laminated layer and to planarize the surface irregularities, and the metal laminated film is polished, after recessed parts of the surface are filled with resin.