METHOD FOR MANUFACTURING LOW TEMPERATURE FIRED CERAMIC SUBSTRATE

PROBLEM TO BE SOLVED: To easily form a projection or a recess with >=30 μm height or depth on the surface of a ceramic substrate fired at low temperature with high dimensional accuracy. SOLUTION: When a low temperature fired ceramic substrate 10 is fired by a press firing method, a forming part 2...

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Bibliographische Detailangaben
Hauptverfasser: NAKA KATSUHIKO, KAWAGUCHI MASAAKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To easily form a projection or a recess with >=30 μm height or depth on the surface of a ceramic substrate fired at low temperature with high dimensional accuracy. SOLUTION: When a low temperature fired ceramic substrate 10 is fired by a press firing method, a forming part 21 in a projection or recess state is preliminarily formed by a green sheet lamination method or a press forming method on the face of a restricting green sheet 20 (such as an alumina green sheet) to be in contact with the surface of the low temperature fired ceramic green substrate. Then, the green substrate is fired while the restricting green sheet 20 is pressed in contact with the green substrate so that the pattern of the formed part 21 in the restricting green sheet 20 is transferred to the substrate surface.