APPARATUS AND METHOD FOR NONCONTACT MEASUREMENT OF SHAPE

PROBLEM TO BE SOLVED: To provide an apparatus and a method for the noncontact measurement of a shape wherein the shape of a substrate and that of a solder bump can be found quickly by medium. SOLUTION: A noncontact shape measuring apparatus is provided with a random light projection means which proj...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKAGAKI TADASHI, KISHIDA KAZUYOSHI, HIRONAKA KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS PRINTED CIRCUITS TESTING
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