APPARATUS AND METHOD FOR NONCONTACT MEASUREMENT OF SHAPE

PROBLEM TO BE SOLVED: To provide an apparatus and a method for the noncontact measurement of a shape wherein the shape of a substrate and that of a solder bump can be found quickly by medium. SOLUTION: A noncontact shape measuring apparatus is provided with a random light projection means which proj...

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Bibliographische Detailangaben
Hauptverfasser: TAKAGAKI TADASHI, KISHIDA KAZUYOSHI, HIRONAKA KOJI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an apparatus and a method for the noncontact measurement of a shape wherein the shape of a substrate and that of a solder bump can be found quickly by medium. SOLUTION: A noncontact shape measuring apparatus is provided with a random light projection means which projects random light while the angle of incidence on a measuring object of projection light from a light source is set at a prescribed angle, a polarization means by which reflected light from the measuring object obtained by projecting the random light at the prescribed angle is polarized to the random light, light having a light component parallel to a reflecting surface and light having a light component perpendicular to the reflecting surface, a detection means of detecting the polarized light, a storage means by which resolution data obtained by a preliminary measurement and data regarding an inspection means are stored, and a shape calculation and processing means which calculates the shape of the measuring object by using detected result data obtained by the detection means, by using the resolution data and by using data regarding the inspection method.