ELECTRONIC EQUIPMENT UNIT AND PACKAGE CONFIGURATION
PROBLEM TO BE SOLVED: To provide a method by which an object to be measured mounted on a package can be debugged and measured at an arbitrary spot in a state where the package is mounted on a mounting unit. SOLUTION: The package 2 is provided with a substrate 4 on which parts are mounted, a front bo...
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| creator | YOSHIHARA MASAYA |
| description | PROBLEM TO BE SOLVED: To provide a method by which an object to be measured mounted on a package can be debugged and measured at an arbitrary spot in a state where the package is mounted on a mounting unit. SOLUTION: The package 2 is provided with a substrate 4 on which parts are mounted, a front board 3 which covers the front face of the package 2 when the package 2 is mounted on the mounting unit 1, and an opening/closing door 10 which partially opens/closes the front board 3 and is closed when the package 2 normally operates while the package 2 is mounted on the mounting unit 1. When waveform measurement, etc., is performed by means of a measuring instrument by fitting a waveform measuring probe, etc., to an IC, etc., mounted on the package 2, the door 10 is kept in an opened state and the waveform measurement, etc., is performed in a state where the package 2 is mounted on the mounting unit 1 by pulling out a measurement probe, cable, etc., from the package 2 through the opening formed by keeping the door 10 in the opened state. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2003037380A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2003037380A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2003037380A3</originalsourceid><addsrcrecordid>eNrjZDB29XF1Dgny9_N0VnANDPUM8HX1C1EI9fMMUXD0c1EIcHT2dnR3VXD293PzdA8Ncgzx9PfjYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgbGBsbmxhYGjsZEKQIA93YnmQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC EQUIPMENT UNIT AND PACKAGE CONFIGURATION</title><source>esp@cenet</source><creator>YOSHIHARA MASAYA</creator><creatorcontrib>YOSHIHARA MASAYA</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a method by which an object to be measured mounted on a package can be debugged and measured at an arbitrary spot in a state where the package is mounted on a mounting unit. SOLUTION: The package 2 is provided with a substrate 4 on which parts are mounted, a front board 3 which covers the front face of the package 2 when the package 2 is mounted on the mounting unit 1, and an opening/closing door 10 which partially opens/closes the front board 3 and is closed when the package 2 normally operates while the package 2 is mounted on the mounting unit 1. When waveform measurement, etc., is performed by means of a measuring instrument by fitting a waveform measuring probe, etc., to an IC, etc., mounted on the package 2, the door 10 is kept in an opened state and the waveform measurement, etc., is performed in a state where the package 2 is mounted on the mounting unit 1 by pulling out a measurement probe, cable, etc., from the package 2 through the opening formed by keeping the door 10 in the opened state.</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; PRINTED CIRCUITS ; TESTING</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030207&DB=EPODOC&CC=JP&NR=2003037380A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030207&DB=EPODOC&CC=JP&NR=2003037380A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHIHARA MASAYA</creatorcontrib><title>ELECTRONIC EQUIPMENT UNIT AND PACKAGE CONFIGURATION</title><description>PROBLEM TO BE SOLVED: To provide a method by which an object to be measured mounted on a package can be debugged and measured at an arbitrary spot in a state where the package is mounted on a mounting unit. SOLUTION: The package 2 is provided with a substrate 4 on which parts are mounted, a front board 3 which covers the front face of the package 2 when the package 2 is mounted on the mounting unit 1, and an opening/closing door 10 which partially opens/closes the front board 3 and is closed when the package 2 normally operates while the package 2 is mounted on the mounting unit 1. When waveform measurement, etc., is performed by means of a measuring instrument by fitting a waveform measuring probe, etc., to an IC, etc., mounted on the package 2, the door 10 is kept in an opened state and the waveform measurement, etc., is performed in a state where the package 2 is mounted on the mounting unit 1 by pulling out a measurement probe, cable, etc., from the package 2 through the opening formed by keeping the door 10 in the opened state.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB29XF1Dgny9_N0VnANDPUM8HX1C1EI9fMMUXD0c1EIcHT2dnR3VXD293PzdA8Ncgzx9PfjYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgbGBsbmxhYGjsZEKQIA93YnmQ</recordid><startdate>20030207</startdate><enddate>20030207</enddate><creator>YOSHIHARA MASAYA</creator><scope>EVB</scope></search><sort><creationdate>20030207</creationdate><title>ELECTRONIC EQUIPMENT UNIT AND PACKAGE CONFIGURATION</title><author>YOSHIHARA MASAYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003037380A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHIHARA MASAYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHIHARA MASAYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC EQUIPMENT UNIT AND PACKAGE CONFIGURATION</title><date>2003-02-07</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To provide a method by which an object to be measured mounted on a package can be debugged and measured at an arbitrary spot in a state where the package is mounted on a mounting unit. SOLUTION: The package 2 is provided with a substrate 4 on which parts are mounted, a front board 3 which covers the front face of the package 2 when the package 2 is mounted on the mounting unit 1, and an opening/closing door 10 which partially opens/closes the front board 3 and is closed when the package 2 normally operates while the package 2 is mounted on the mounting unit 1. When waveform measurement, etc., is performed by means of a measuring instrument by fitting a waveform measuring probe, etc., to an IC, etc., mounted on the package 2, the door 10 is kept in an opened state and the waveform measurement, etc., is performed in a state where the package 2 is mounted on the mounting unit 1 by pulling out a measurement probe, cable, etc., from the package 2 through the opening formed by keeping the door 10 in the opened state.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS TESTING |
| title | ELECTRONIC EQUIPMENT UNIT AND PACKAGE CONFIGURATION |
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