ELECTRONIC EQUIPMENT UNIT AND PACKAGE CONFIGURATION

PROBLEM TO BE SOLVED: To provide a method by which an object to be measured mounted on a package can be debugged and measured at an arbitrary spot in a state where the package is mounted on a mounting unit. SOLUTION: The package 2 is provided with a substrate 4 on which parts are mounted, a front board 3 which covers the front face of the package 2 when the package 2 is mounted on the mounting unit 1, and an opening/closing door 10 which partially opens/closes the front board 3 and is closed when the package 2 normally operates while the package 2 is mounted on the mounting unit 1. When waveform measurement, etc., is performed by means of a measuring instrument by fitting a waveform measuring probe, etc., to an IC, etc., mounted on the package 2, the door 10 is kept in an opened state and the waveform measurement, etc., is performed in a state where the package 2 is mounted on the mounting unit 1 by pulling out a measurement probe, cable, etc., from the package 2 through the opening formed by keeping the door 10 in the opened state.