HEAT DISSIPATING MEMBER AND PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT

PROBLEM TO BE SOLVED: To solve the problem that it is difficult to efficiently disperse the heat generated from the semiconductor element which is mounted, related to a package for housing the semiconductor element. SOLUTION: A package 7 for housing a semiconductor element made from a plate comprising silicon carbide particles and copper is provided where an insulating frame 2 is so jointed to a heat dissipating member 1 in which the mounting part for a semiconductor element 3 is provided at the center of a main surface as to enclose the mounting part using the heat dissipating member 1 in which the particle size of silicon carbide particles is larger on the surface side while smaller in the central part in the thickness direction. The reliable package 7 for housing semiconductor element comprises the heat dissipating member 1 whose thermal conductivity is improved without raising a thermal expansion coefficient, so that the heat from the semiconductor element 3 is effectively dispersed while no high heat stress takes place on the junction interface between the insulating frame 2 and the semiconductor element 3.