PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor package in which a seal ring is fitted rigidly with reliability by improving the shape of the seal ring, without increasing the width of a metallized layer on the upper surface of a frame nor changing the cross-section shape of the metallized layer. SOLUTION: There are provided a base 1 comprising, on the upper-side main surface, a placement part 1a on which a semiconductor element 5 is placed, a frame 2 in which, so fitted as to enclose the placement part 1a on the upper- side main surface of the substrate 1, a metallized layer 2a is formed on the upper surface while an input/output electrode 1b is so formed as to penetrate the side part, and a seal ring 3 fitted to the upper surface of the metallized layer 2a. An inner-peripheral surface 3a of the seal ring 3 is wave-form 3b when viewed from above.