EPOXY RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has an improved glass transition temperature and a decreased cure shrinkage stress and suppresses the occurrence of voids. SOLUTION: This epoxy resin composition for sealing contains a cyclic epoxy resin as the first main ingredient,...

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Bibliographische Detailangaben
Hauptverfasser:	IMAIZUMI NOBUHIRO, YAGI TOMOHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has an improved glass transition temperature and a decreased cure shrinkage stress and suppresses the occurrence of voids. SOLUTION: This epoxy resin composition for sealing contains a cyclic epoxy resin as the first main ingredient, a naphthalene-type or bisphenol-type epoxy resin as the second main ingredient, and hydogenated methylnadic anhydride as a curing agent.