TRANSFER SHEET FOR FORMING WIRING BOARD

PROBLEM TO BE SOLVED: To obtain a transfer sheet for wiring board exhibiting excellent chemical resistance and dimensional stability and especially exhibiting excellent transfer stability in a circuit including microwiring having line width of 50 μm or less. SOLUTION: The transfer sheet for wiring b...

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Bibliographische Detailangaben
Hauptverfasser:	SUEZAWA MITSURU, YOKURA MITSUYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a transfer sheet for wiring board exhibiting excellent chemical resistance and dimensional stability and especially exhibiting excellent transfer stability in a circuit including microwiring having line width of 50 μm or less. SOLUTION: The transfer sheet for wiring board comprises a fluororesin layer and a metal foil formed sequentially on a resin film.