CIRCUIT BOARD AND ITS PRODUCING METHOD AND HIGH OUTPUT MODULE

PROBLEM TO BE SOLVED: To provide a circuit board for a small high output module by decreasing the resistance of wiring while reducing the wring pattern. SOLUTION: The circuit board comprises a first metal layer 14 patterned on a ceramic substrate 11, and a second metal layer 16 patterned with a thic...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TATO NOBUYOSHI, NAKANISHI SHUSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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