CIRCUIT BOARD AND ITS PRODUCING METHOD AND HIGH OUTPUT MODULE

CIRCUIT BOARD AND ITS PRODUCING METHOD AND HIGH OUTPUT MODULE

PROBLEM TO BE SOLVED: To provide a circuit board for a small high output module by decreasing the resistance of wiring while reducing the wring pattern. SOLUTION: The circuit board comprises a first metal layer 14 patterned on a ceramic substrate 11, and a second metal layer 16 patterned with a thic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TATO NOBUYOSHI, NAKANISHI SHUSUKE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a circuit board for a small high output module by decreasing the resistance of wiring while reducing the wring pattern. SOLUTION: The circuit board comprises a first metal layer 14 patterned on a ceramic substrate 11, and a second metal layer 16 patterned with a thickness not less than 0.5 μm. It may further comprises a third metal layer 13 patterned on the same plane as the first metal layer. The second metal layer 16 has surface of Au, or the like, not being etched.