CURABLE COMPOSITION FOR ETCHING RESIST

PROBLEM TO BE SOLVED: To provide a curable composition for an etching resist giving a cured film excellent in etching resistance even in secondary etching at a high temperature and excellent also in suitability to subsequent alkali dissolution and removal and in pattern forming property and suitable...

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Bibliographische Detailangaben
Hauptverfasser:	NIWA MAKOTO, NAGOSHI HIROYUKI, IGARASHI ICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a curable composition for an etching resist giving a cured film excellent in etching resistance even in secondary etching at a high temperature and excellent also in suitability to subsequent alkali dissolution and removal and in pattern forming property and suitable for use as a backing material particularly in the manufacture of a shadow mask. SOLUTION: The curable composition contains (a) a compound having one carboxyl group and one (meth)acryloyl group in one molecule and (b) a compound having two or more (meth)acryloyl groups as a product obtained by esterifying a polyol having 3-6 hydroxyl groups with a 3-12C monocarboxylic acid and (meth)acrylic acid.