REFLOW SOLDERING METHOD

PROBLEM TO BE SOLVED: To provide a soldering method of a VPS(vapor phase soldering) system with the aim of mass production using tin - zinc based lead free solder thereby to realize electronic equipment having a long service life. SOLUTION: An inert liquid 2 having a known boiling point temperature...

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Bibliographische Detailangaben
1. Verfasser:	SAWABE HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a soldering method of a VPS(vapor phase soldering) system with the aim of mass production using tin - zinc based lead free solder thereby to realize electronic equipment having a long service life. SOLUTION: An inert liquid 2 having a known boiling point temperature higher than the melting point of solder by about 10 deg.C is evaporated, and the concentration of oxygen in the vapor atmosphere 2a is controlled to