CHIP COIL

PROBLEM TO BE SOLVED: To enhance reliability of a press-bonding section of a wire terminal to a terminal electrode of a wire fire fixing section. SOLUTION: Wire fixing sections 1b and 1c or brims for forming the terminal electrode are formed in a tapered shape by inclining upward from a wire wound s...

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1. Verfasser: TOI TAKAOMI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To enhance reliability of a press-bonding section of a wire terminal to a terminal electrode of a wire fire fixing section. SOLUTION: Wire fixing sections 1b and 1c or brims for forming the terminal electrode are formed in a tapered shape by inclining upward from a wire wound section to an end of the brims. The terminal electrode formed on the wire fixing section along the tapered shape of the wire fixing section causes its top formed outside of the center of the wire fixing section (in a position further apart from the wire wound section), and the wire terminal is stably press-bonded to the terminal electrode with its wide press-bonding surface.