EPOXY RESIN, EPOXY RESIN COMPOSITION INCLUDING THE SAME, AND CURED PRODUCT OF THE COMPOSITION

PROBLEM TO BE SOLVED: To obtain an epoxy resin as a viscous liquid, semi-solid or solid form having no crystal at normal temperatures, and a composition including the epoxy resin, suitable for coating materials, molding materials, composite materials, adhesives, electrical/electronic parts insulatin...

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Bibliographische Detailangaben
Hauptverfasser:	SAITO YOSHIHISA, NAKANISHI HIROSHI, HANABUSA MASAYOSHI, SHINOHARA CHIKAYA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain an epoxy resin as a viscous liquid, semi-solid or solid form having no crystal at normal temperatures, and a composition including the epoxy resin, suitable for coating materials, molding materials, composite materials, adhesives, electrical/electronic parts insulating materials, laminated boards, or the like, each giving cured product excellent in heat resistance, adhesiveness, water resistance, mechanical properties and electrical properties. SOLUTION: The epoxy resin is obtained by reaction between an aromatic compound of formula (1) and an epihalohydrin, and is represented by formula (2) [where, R1 to R4 are each a 1-6C hydrocarbon group; (n) is an integer of >=0; and X in the above aromatic compound of formula (1) is absent or a group of the general formula (where, R5 and R6 are each H or a 1-6C hydrocarbon group)]. The epoxy resin thus obtained is characterized by having such molecular weight distribution as to be =250 g/eq in epoxy equivalent.