INDIUM OXIDE POWDER AND METHOD FOR MANUFACTURING ITO SPUTTERING TARGET

PROBLEM TO BE SOLVED: To provide an indium oxide powder, capable of suppressing the occurrence of crack after cast molding and suppressing the occurrence of nodule, and to provide a method for manufacturing an ITO sputtering target. SOLUTION: The indium oxide powder satisfies at least one of propert...

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Hauptverfasser:	NAGASAKI YUICHI, TERAOKA HIDEKI, KUROSAWA SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE CEMENTS CERAMICS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIME, MAGNESIA METALLURGY REFRACTORIES SLAG SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF NATURAL STONE
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an indium oxide powder, capable of suppressing the occurrence of crack after cast molding and suppressing the occurrence of nodule, and to provide a method for manufacturing an ITO sputtering target. SOLUTION: The indium oxide powder satisfies at least one of properties (1)-(3): (1) Initial bulk density is 0.3-1.0 g/cm . (2) Tap bulk density is 0.7-1.5 g/cm . (3) Compression degree expressed by (tap bulk density-initial bulk density)×100/(tap bulk density) is 14-80. The ITO sputtering target consisting of an ITO sintered compact is manufactured by mixing the indium oxide powder with tin oxide powder, cast molding and firing them.