CARRIER TAPE

PROBLEM TO BE SOLVED: To provide a carrier tape in which a conventional small-sized QFN package does not contact with the side surface and side bottom portion and also the bottom center part of a component part, and in which the QFN package does not get into touch with a housing recessed portion to...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NARISAWA KOJI, SONODA KAZUHITO, SHIROISHI YASUNOBU, HAGA JUNICHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a carrier tape in which a conventional small-sized QFN package does not contact with the side surface and side bottom portion and also the bottom center part of a component part, and in which the QFN package does not get into touch with a housing recessed portion to the utmost. SOLUTION: In a carrier tape 1 in which a number of housing recessed portions 5 opened on the surface are formed at predetermined intervals in the longitudinal direction and which houses an electronic component 10 in the housing recessed portion 5, three points of protruded portions 1 are provided on an inner bottom surface 2 of the housing recessed portion 5, and the portion of the barycenter of the inside bottom surface 2 is positioned inside a flat triangle formed by the three points of the protruded portions 1.