LIGHT EMITTER, LIGHT-EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To improve heat radiation property of a light emitter using an LED or the like, while maintaining mountability to a circuit board. SOLUTION: A lead frame 27 and 28 of the light emitter 21 is provided with narrow terminals 25a and 25b for electrical conduction for supplying a cu...

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Bibliographische Detailangaben
Hauptverfasser:	OSUMI YOSHIMASA, KIYOMOTO HIRONOBU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve heat radiation property of a light emitter using an LED or the like, while maintaining mountability to a circuit board. SOLUTION: A lead frame 27 and 28 of the light emitter 21 is provided with narrow terminals 25a and 25b for electrical conduction for supplying a current to a light-emitting element chip, and wide terminals 26a and 26b for heat radiation for radiating the heat generated by the light-emitting element chip. The terminal 25a and 25b for electrical conduction are connected to the circuit board 34, using a material (bonding material) 40 having a small electrical resistance, such as solder, while the terminals 26a and 26b for heat radiation are connected to the circuit board 34, using a material (bonding material) 39 having proper heat conductivity, such as a silver paste.