METHOD AND DEVICE FOR DETECTING POLISHING END POINT

PROBLEM TO BE SOLVED: To detect a polishing end point at intervals of a time which is smaller than a measurement interval. SOLUTION: With times t1, t2, t3, and so on, while a machine platen is rotating taken as measuring times, spectral characteristics of reflected light, when light is irradiated on...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: FURUSAWA TAKUICHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator FURUSAWA TAKUICHI
description PROBLEM TO BE SOLVED: To detect a polishing end point at intervals of a time which is smaller than a measurement interval. SOLUTION: With times t1, t2, t3, and so on, while a machine platen is rotating taken as measuring times, spectral characteristics of reflected light, when light is irradiated on the surface of a wafer in a polishing center and reflected thereon, is extracted and made associated with data of most similar one of models. A straight line M, approximated as the correspondence relation between the spectral characteristic and model data is set, and a time tE, corresponding to model data M12 of a polishing end point on the straight line M, is extracted to predict the remaining time, until the polishing end point.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2002359217A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2002359217A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2002359217A3</originalsourceid><addsrcrecordid>eNrjZDD2dQ3x8HdRcPRzUXBxDfN0dlVw8w8CMkNcnUM8_dwVAvx9PIM9QCxXoJIAf0-_EB4G1rTEnOJUXijNzaDk5hri7KGbWpAfn1pckJicmpdaEu8VYGRgYGRsamlkaO5oTJQiAMYcJzw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD AND DEVICE FOR DETECTING POLISHING END POINT</title><source>esp@cenet</source><creator>FURUSAWA TAKUICHI</creator><creatorcontrib>FURUSAWA TAKUICHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To detect a polishing end point at intervals of a time which is smaller than a measurement interval. SOLUTION: With times t1, t2, t3, and so on, while a machine platen is rotating taken as measuring times, spectral characteristics of reflected light, when light is irradiated on the surface of a wafer in a polishing center and reflected thereon, is extracted and made associated with data of most similar one of models. A straight line M, approximated as the correspondence relation between the spectral characteristic and model data is set, and a time tE, corresponding to model data M12 of a polishing end point on the straight line M, is extracted to predict the remaining time, until the polishing end point.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20021213&amp;DB=EPODOC&amp;CC=JP&amp;NR=2002359217A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20021213&amp;DB=EPODOC&amp;CC=JP&amp;NR=2002359217A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FURUSAWA TAKUICHI</creatorcontrib><title>METHOD AND DEVICE FOR DETECTING POLISHING END POINT</title><description>PROBLEM TO BE SOLVED: To detect a polishing end point at intervals of a time which is smaller than a measurement interval. SOLUTION: With times t1, t2, t3, and so on, while a machine platen is rotating taken as measuring times, spectral characteristics of reflected light, when light is irradiated on the surface of a wafer in a polishing center and reflected thereon, is extracted and made associated with data of most similar one of models. A straight line M, approximated as the correspondence relation between the spectral characteristic and model data is set, and a time tE, corresponding to model data M12 of a polishing end point on the straight line M, is extracted to predict the remaining time, until the polishing end point.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD2dQ3x8HdRcPRzUXBxDfN0dlVw8w8CMkNcnUM8_dwVAvx9PIM9QCxXoJIAf0-_EB4G1rTEnOJUXijNzaDk5hri7KGbWpAfn1pckJicmpdaEu8VYGRgYGRsamlkaO5oTJQiAMYcJzw</recordid><startdate>20021213</startdate><enddate>20021213</enddate><creator>FURUSAWA TAKUICHI</creator><scope>EVB</scope></search><sort><creationdate>20021213</creationdate><title>METHOD AND DEVICE FOR DETECTING POLISHING END POINT</title><author>FURUSAWA TAKUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2002359217A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FURUSAWA TAKUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FURUSAWA TAKUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD AND DEVICE FOR DETECTING POLISHING END POINT</title><date>2002-12-13</date><risdate>2002</risdate><abstract>PROBLEM TO BE SOLVED: To detect a polishing end point at intervals of a time which is smaller than a measurement interval. SOLUTION: With times t1, t2, t3, and so on, while a machine platen is rotating taken as measuring times, spectral characteristics of reflected light, when light is irradiated on the surface of a wafer in a polishing center and reflected thereon, is extracted and made associated with data of most similar one of models. A straight line M, approximated as the correspondence relation between the spectral characteristic and model data is set, and a time tE, corresponding to model data M12 of a polishing end point on the straight line M, is extracted to predict the remaining time, until the polishing end point.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2002359217A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
title METHOD AND DEVICE FOR DETECTING POLISHING END POINT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T09%3A56%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FURUSAWA%20TAKUICHI&rft.date=2002-12-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2002359217A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true