METHOD AND DEVICE FOR DETECTING POLISHING END POINT

PROBLEM TO BE SOLVED: To detect a polishing end point at intervals of a time which is smaller than a measurement interval. SOLUTION: With times t1, t2, t3, and so on, while a machine platen is rotating taken as measuring times, spectral characteristics of reflected light, when light is irradiated on...

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Bibliographische Detailangaben
1. Verfasser:	FURUSAWA TAKUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To detect a polishing end point at intervals of a time which is smaller than a measurement interval. SOLUTION: With times t1, t2, t3, and so on, while a machine platen is rotating taken as measuring times, spectral characteristics of reflected light, when light is irradiated on the surface of a wafer in a polishing center and reflected thereon, is extracted and made associated with data of most similar one of models. A straight line M, approximated as the correspondence relation between the spectral characteristic and model data is set, and a time tE, corresponding to model data M12 of a polishing end point on the straight line M, is extracted to predict the remaining time, until the polishing end point.